Tactile whole-field imaging sensor on photoelasticity
Authors: Dubey, V.N. and Grewal, G.S.
Journal: 2007 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC2007
Volume: 4
Pages: 339-345
ISBN: 9780791848050
DOI: 10.1115/DETC2007-35264
Abstract:The paper describes a whole-field imaging sensor developed on the principles of photoelasticity. The sensor produces colored fringe patterns when load is applied on the contacting surface. These fringes can be analyzed using conventional photoelastic techniques, however, as the loading in the present case is not conventional some new strategies need to be devised to analyze the load imprint. The loading is unconventional in the sense that low modulus photoelastic material is deformed under vertical load in the direction of light travel to induce the photoelastic effect. The paper discusses the efficacy of both RGB calibration and phase shifting techniques in sensing applications. The characteristics of fringe patterns obtained under vertical and shear loads have been studied and the results obtained under these conditions are discussed with their limitations specifically when this is applied for sensing applications. Finally a case study has been conducted to analyze a foot image and conclusions drawn from this have been presented. Copyright © 2007 by ASME.
https://eprints.bournemouth.ac.uk/10716/
Source: Scopus
Tactile whole-field imaging sensor on photoelasticity
Authors: Dubey, V.N. and Grewal, G.S.
Journal: DETC2007: PROCEEDINGS OF THE ASME INTERNATIONAL DESIGN ENGINEERING TECHNOLOGY CONFERENCE AND COMPUTERS AND INFORMATION IN ENGINEERING CONFERENCE, VOL 4
Pages: 339-345
ISBN: 978-0-7918-4805-0
https://eprints.bournemouth.ac.uk/10716/
Source: Web of Science (Lite)
Tactile whole-field imaging sensor on photoelasticity
Authors: Dubey, V.N. and Grewal, G.S.
Conference: ASME International Design Engineering Technical Conference
Dates: 4-7 September 2007
Pages: 339-345
Abstract:The paper describes a whole-field imaging sensor developed on the principles of photoelasticity. The sensor produces colored fringe patterns when load is applied on the contacting surface. These fringes can be analyzed using conventional photoelastic techniques, however, as the loading in the present case is not conventional some new strategies need to be devised to analyze the load imprint. The loading is unconventional in the sense that low modulus photoelastic material is deformed under vertical load in the direction of light travel to induce the photoelastic effect. The paper discusses the efficacy of both RGB calibration and phase shifting techniques in sensing applications. The characteristics of fringe patterns obtained under vertical and shear loads have been studied and the results obtained under these conditions are discussed with their limitations specifically when this is applied for sensing applications. Finally a case study has been conducted to analyze a foot image and conclusions drawn from this have been presented. Copyright © 2007 by ASME.
https://eprints.bournemouth.ac.uk/10716/
Source: Manual
Preferred by: Venky Dubey
Tactile whole-field imaging sensor on photoelasticity
Authors: Dubey, V.N. and Grewal, G.S.
Conference: ASME International Design Engineering Technical Conference
Pages: 339-345
Abstract:The paper describes a whole-field imaging sensor developed on the principles of photoelasticity. The sensor produces colored fringe patterns when load is applied on the contacting surface. These fringes can be analyzed using conventional photoelastic techniques, however, as the loading in the present case is not conventional some new strategies need to be devised to analyze the load imprint. The loading is unconventional in the sense that low modulus photoelastic material is deformed under vertical load in the direction of light travel to induce the photoelastic effect. The paper discusses the efficacy of both RGB calibration and phase shifting techniques in sensing applications. The characteristics of fringe patterns obtained under vertical and shear loads have been studied and the results obtained under these conditions are discussed with their limitations specifically when this is applied for sensing applications. Finally a case study has been conducted to analyze a foot image and conclusions drawn from this have been presented. Copyright © 2007 by ASME.
https://eprints.bournemouth.ac.uk/10716/
Source: BURO EPrints