Enhanced thermal stability of nanocrystalline Cu composites processed by high-pressure torsion: The pinning effect of Al₂O₃, GO, and rGO/Al₂O₃ nanoparticles
Authors: Bazarnik, P., Emerla, M., Huang, Y., Wojciechowska, A., Ciemiorek, M., Bednarczyk, W., Jastrzębska, A., Lewandowska, M. and Langdon, T.G.
Journal: Journal of Alloys and Compounds
Volume: 1033
ISSN: 0925-8388
DOI: 10.1016/j.jallcom.2025.181283
Abstract:Metal matrix composites with improved mechanical properties and thermal stability were produced using mechanical milling, spark plasma sintering (SPS) and high-pressure torsion (HPT). Three types of reinforcing particles were used, i.e., GO, Al
https://eprints.bournemouth.ac.uk/41071/
Source: Scopus
Enhanced thermal stability of nanocrystalline Cu composites processed by high-pressure torsion: The pinning effect of Al<sub>2</sub>O<sub>3</sub>, GO, and rGO/Al<sub>2</sub>O<sub>3</sub> nanoparticles
Authors: Bazarnik, P., Emerla, M., Huang, Y., Wojciechowska, A., Ciemiorek, M., Bednarczyk, W., Ebska, A.J., Lewandowska, M. and Langdon, T.G.
Journal: JOURNAL OF ALLOYS AND COMPOUNDS
Volume: 1033
eISSN: 1873-4669
ISSN: 0925-8388
DOI: 10.1016/j.jallcom.2025.181283
https://eprints.bournemouth.ac.uk/41071/
Source: Web of Science (Lite)
Enhanced thermal stability of nanocrystalline Cu composites processed by high-pressure torsion: The pinning effect of Al₂O₃, GO, and rGO/Al₂O₃ nanoparticles
Authors: Bazarnik, P., Emerla, M., Huang, Y., Wojciechowska, A., Ciemiorek, M., Bednarczyk, W., Jastrzębska, A., Lewandowska, M. and Langdon, T.G.
Journal: Journal of Alloys and Compounds
Volume: 1033
Pages: 181283(1)-181283(12)
Publisher: Elsevier
eISSN: 1873-4669
ISSN: 0925-8388
DOI: 10.1016/j.jallcom.2025.181283
Abstract:Metal matrix composites with improved mechanical properties and thermal stability were produced using mechanical milling, spark plasma sintering (SPS) and high-pressure torsion (HPT). Three types of reinforcing particles were used GO, Al2O3 and rGO/Al2O3. All of the produced composites exhibit higher hardness and tensile strength than pure coper, reaching values of 250 Hv for Cu-GO, 240 Hv for Cu- Al2O3, 210 Hv for Cu- rGO/Al2O3 and 185 Hv for Cu after HPT. STEM analyses reveal that the HPT significantly refines the grain size of pure copper to ~210 nm, and even more in the Cu-based composites achieving grain sizes as small as ~55-75 nm. Pure Cu after HPT recrystalizes after annealing at 573 K. The Cu-Al₂O₃ composite demonstrated the best thermal stability with a hardness after annealing at 773 K of 220 Hv and a grain size of ~100 nm. The composite of Cu-GO after annealing at 773 K showed slight grain growth up to ~150 nm. The composite Cu-GO/Al2O3 exhibited improved microhardness and tensile strength up to 673 K and annealing of this composite at 773 K led to a bimodal microstructure. All of the composites annealed at 773 K had a hardness above 180 Hv.
https://eprints.bournemouth.ac.uk/41071/
Source: Manual
Enhanced thermal stability of nanocrystalline Cu composites processed by high-pressure torsion: The pinning effect of Al₂O₃, GO, and rGO/Al₂O₃ nanoparticles
Authors: Bazarnik, P., Emerla, M., Huang, Y., Wojciechowska, A., Ciemiorek, M., Bednarczyk, W., Jastrzębska, A., Lewandowska, M. and Langdon, T.G.
Journal: Journal of Alloys and Compounds
Volume: 1033
Publisher: Elsevier
ISSN: 0925-8388
Abstract:Metal matrix composites with improved mechanical properties and thermal stability were produced using mechanical milling, spark plasma sintering (SPS) and high-pressure torsion (HPT). Three types of reinforcing particles were used GO, Al2O3 and rGO/Al2O3. All of the produced composites exhibit higher hardness and tensile strength than pure coper, reaching values of 250 Hv for Cu-GO, 240 Hv for Cu- Al2O3, 210 Hv for Cu- rGO/Al2O3 and 185 Hv for Cu after HPT. STEM analyses reveal that the HPT significantly refines the grain size of pure copper to ~210 nm, and even more in the Cu-based composites achieving grain sizes as small as ~55-75 nm. Pure Cu after HPT recrystalizes after annealing at 573 K. The Cu-Al₂O₃ composite demonstrated the best thermal stability with a hardness after annealing at 773 K of 220 Hv and a grain size of ~100 nm. The composite of Cu-GO after annealing at 773 K showed slight grain growth up to ~150 nm. The composite Cu-GO/Al2O3 exhibited improved microhardness and tensile strength up to 673 K and annealing of this composite at 773 K led to a bimodal microstructure. All of the composites annealed at 773 K had a hardness above 180 Hv.
https://eprints.bournemouth.ac.uk/41071/
Source: BURO EPrints