Enhanced thermal stability of nanocrystalline Cu composites processed by high-pressure torsion: The pinning effect of Al₂O₃, GO, and rGO/Al₂O₃ nanoparticles

Authors: Bazarnik, P., Emerla, M., Huang, Y., Wojciechowska, A., Ciemiorek, M., Bednarczyk, W., Jastrzębska, A., Lewandowska, M. and Langdon, T.G.

Journal: Journal of Alloys and Compounds

Volume: 1033

ISSN: 0925-8388

DOI: 10.1016/j.jallcom.2025.181283

Abstract:

Metal matrix composites with improved mechanical properties and thermal stability were produced using mechanical milling, spark plasma sintering (SPS) and high-pressure torsion (HPT). Three types of reinforcing particles were used, i.e., GO, Al2O3 and rGO/Al2O3. All of the produced composites exhibit higher hardness and tensile strength than pure copper, reaching values of 250 Hv for Cu-GO, 240 Hv for Cu- Al2O3, 210 Hv for Cu- rGO/Al2O3 and 185 Hv for Cu after HPT. STEM analyses reveal that the HPT significantly refines the grain size of pure copper to ∼210 nm, and even more in the Cu-based composites achieving grain sizes as small as ∼55–75 nm. Pure Cu after HPT recrystallizes after annealing at 573 K. The Cu- Al₂O₃ composite demonstrated the best thermal stability with a hardness after annealing at 773 K of 220 Hv and a grain size of ∼100 nm. The composite of Cu-GO after annealing at 773 K showed slight grain growth up to ∼150 nm. The composite Cu-GO/Al2O3 exhibits improved microhardness and tensile strength up to 673 K and annealing of this composite at 773 K which led to a bimodal microstructure. All of the composites annealed at 773 K showed hardness above 180 Hv.

https://eprints.bournemouth.ac.uk/41071/

Source: Scopus

Enhanced thermal stability of nanocrystalline Cu composites processed by high-pressure torsion: The pinning effect of Al<sub>2</sub>O<sub>3</sub>, GO, and rGO/Al<sub>2</sub>O<sub>3</sub> nanoparticles

Authors: Bazarnik, P., Emerla, M., Huang, Y., Wojciechowska, A., Ciemiorek, M., Bednarczyk, W., Ebska, A.J., Lewandowska, M. and Langdon, T.G.

Journal: JOURNAL OF ALLOYS AND COMPOUNDS

Volume: 1033

eISSN: 1873-4669

ISSN: 0925-8388

DOI: 10.1016/j.jallcom.2025.181283

https://eprints.bournemouth.ac.uk/41071/

Source: Web of Science (Lite)

Enhanced thermal stability of nanocrystalline Cu composites processed by high-pressure torsion: The pinning effect of Al₂O₃, GO, and rGO/Al₂O₃ nanoparticles

Authors: Bazarnik, P., Emerla, M., Huang, Y., Wojciechowska, A., Ciemiorek, M., Bednarczyk, W., Jastrzębska, A., Lewandowska, M. and Langdon, T.G.

Journal: Journal of Alloys and Compounds

Volume: 1033

Pages: 181283(1)-181283(12)

Publisher: Elsevier

eISSN: 1873-4669

ISSN: 0925-8388

DOI: 10.1016/j.jallcom.2025.181283

Abstract:

Metal matrix composites with improved mechanical properties and thermal stability were produced using mechanical milling, spark plasma sintering (SPS) and high-pressure torsion (HPT). Three types of reinforcing particles were used GO, Al2O3 and rGO/Al2O3. All of the produced composites exhibit higher hardness and tensile strength than pure coper, reaching values of 250 Hv for Cu-GO, 240 Hv for Cu- Al2O3, 210 Hv for Cu- rGO/Al2O3 and 185 Hv for Cu after HPT. STEM analyses reveal that the HPT significantly refines the grain size of pure copper to ~210 nm, and even more in the Cu-based composites achieving grain sizes as small as ~55-75 nm. Pure Cu after HPT recrystalizes after annealing at 573 K. The Cu-Al₂O₃ composite demonstrated the best thermal stability with a hardness after annealing at 773 K of 220 Hv and a grain size of ~100 nm. The composite of Cu-GO after annealing at 773 K showed slight grain growth up to ~150 nm. The composite Cu-GO/Al2O3 exhibited improved microhardness and tensile strength up to 673 K and annealing of this composite at 773 K led to a bimodal microstructure. All of the composites annealed at 773 K had a hardness above 180 Hv.

https://eprints.bournemouth.ac.uk/41071/

Source: Manual

Enhanced thermal stability of nanocrystalline Cu composites processed by high-pressure torsion: The pinning effect of Al₂O₃, GO, and rGO/Al₂O₃ nanoparticles

Authors: Bazarnik, P., Emerla, M., Huang, Y., Wojciechowska, A., Ciemiorek, M., Bednarczyk, W., Jastrzębska, A., Lewandowska, M. and Langdon, T.G.

Journal: Journal of Alloys and Compounds

Volume: 1033

Publisher: Elsevier

ISSN: 0925-8388

Abstract:

Metal matrix composites with improved mechanical properties and thermal stability were produced using mechanical milling, spark plasma sintering (SPS) and high-pressure torsion (HPT). Three types of reinforcing particles were used GO, Al2O3 and rGO/Al2O3. All of the produced composites exhibit higher hardness and tensile strength than pure coper, reaching values of 250 Hv for Cu-GO, 240 Hv for Cu- Al2O3, 210 Hv for Cu- rGO/Al2O3 and 185 Hv for Cu after HPT. STEM analyses reveal that the HPT significantly refines the grain size of pure copper to ~210 nm, and even more in the Cu-based composites achieving grain sizes as small as ~55-75 nm. Pure Cu after HPT recrystalizes after annealing at 573 K. The Cu-Al₂O₃ composite demonstrated the best thermal stability with a hardness after annealing at 773 K of 220 Hv and a grain size of ~100 nm. The composite of Cu-GO after annealing at 773 K showed slight grain growth up to ~150 nm. The composite Cu-GO/Al2O3 exhibited improved microhardness and tensile strength up to 673 K and annealing of this composite at 773 K led to a bimodal microstructure. All of the composites annealed at 773 K had a hardness above 180 Hv.

https://eprints.bournemouth.ac.uk/41071/

Source: BURO EPrints